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AIXTRON launches the new G10-AsP system at Photonic West AIXTRON’s planetary technology sets the ground for the next generation of high-resolution Micro LED displays and lasers Herzogenrath, January 26, 2023 – AIXTRON SE (FSE: AIXA, ISIN DE000A0WMPJ6) launches the first fully automated AsP platform to the market. The new system G10-AsP addresses the growing demands in the fields of Micro LED and laser devices. As first system in the industry, the G10-AsP enables a robust high-volume production which is linked to very high and complex requirements. “Micro LEDs will revolutionize the world of displays as they offer better durability, higher lifetime, a better picture quality and a very low energy consumption. However, this innovative technology challenges the production process as it requires lowest defect levels and highest uniformity rates. The answer to all this our new G10-AsP as it offers the industry’s first fully automated process. The new system enables the highest throughput of its class with uniformity and defect levels never seen before”, says Dr. Felix Grawert, CEO and President of AIXTRON SE. For the first time, a true mass production of Micro LEDs with the most tightened material requirements and reduced chip sizes of 10 micron and lower is becoming a reality. Additionally, the G10-AsP also meets the complex requirements to produce InP (Indium phosphide) laser and VCSEL (Vertical Cavity Surface Emitting laser) in high volumes. The new platform G10-AsP will officially be launched on 1st of February 2023 during the Photonic West exhibition in San Francisco, USA. During this event, AIXTRON experts will present the new system: They will explain all the innovations that are packed into the new platform and how it will provide the highest throughput of its class and maximize cleanroom utilization. The new fully automated G10-AsP is the largest 200mm AsP Batch reactor released to the market and comes with In-Situ Cleaning and an automated cassette-to-cassette (C2C) wafer loading. For the first time, the Front-End can be equipped with SMIF (Standard Mechanical Interface) pods to further minimize the exposure of the epitaxial wafers to the room environment. With the In-Situ cleaning built-in, users can reset the chamber conditions on demand – be it after each process run for the most demanding requirements or just after a production campaign to benefit from highest throughputs. The platform is based on the successful Planetary Reactor® technology which combines the multiwafer batch reactor concept with single wafer rotation to guarantee highest wafer uniformity. Micro LEDs will not only be used for the next generation of TV displays but also for future smart watches, smart phones, Augmented Reality (AR) projection or automotive displays. Analysts expect this area to be the largest market for LEDs in the next five to ten years. The one big challenge to reach the next level for advanced Micro LEDs, but also for InP and VCSEL applications remains uniformity: Optimized on-wafer uniformity and wafer-to-wafer uniformity must be accomplished in a high-volume production process. The new G10-AsP sets a new standard with respect to these values, offering a two-to-threefold improvement compared to its predecessor. Hence, this fully automated platform will initiate a new era to produce Micro LED and photonic devices, overcoming major obstacles that previously have prevented a robust mass production. Photonic devices such as infrared lasers and detectors have already been adopted broadly in the market. In telecommunications, they lay the foundation to manage ever-growing data volumes which are linked to continuously higher bandwidth requirements. Also, they enable 3D sensing, e.g., for facial recognition, and advanced technologies for autonomous driving: With the continuous evolvement of this technology, beams must map larger and wider areas. This calls for tighter wavelength tolerances which translate into very tight requirements for the epitaxial layer deposition. The new G10-AsP can address this need by providing a significantly refined control of the epitaxial process with improved material accuracy, reduced defects and as a result higher yield and better uniformity. In the production of Micro LEDs, an improved uniformity is the prerequisite for economical viable mass production: Micro LED displays rely on a special stamp or matrix transfer process where thousands of LED chips (arrays) of just a few micrometers in size are picked up and transferred. Because entire arrays of pixels are transferred from the epi-wafer substrate, almost perfect uniformity is required – or could you imagine anyone purchasing a smartwatch or smartphone with a display having a different color in one corner than the other?
Contact Persons Guido Pickert
Ragah Dorenkamp The new fully automated AIX G10-AsP is the largest 200mm AsP Batch reactor released to the market and comes with In-Situ Cleaning and an automated cassette-to-cassette (C2C) wafer loading.
About AIXTRON AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications. Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level SolutionS®, Close Coupled Showerhead®, CRIUS®, Gas Foil Rotation®, OVPD®, Planetary Reactor®, PVPD®, TriJet® For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com
This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize, or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semi-conductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.
This document is an English language translation of a document in German language. In case of discrepancies, the German language document shall prevail and shall be the valid version.
End of Media Release Issuer: AIXTRON SE Key word(s): Research/Technology
26.01.2023 CET/CEST Dissemination of a Press Release, transmitted by EQS News - a service of EQS Group AG. |
| Language: | English |
| Company: | AIXTRON SE |
| Dornkaulstraße 2 | |
| 52134 Herzogenrath | |
| Germany | |
| Phone: | +49 (2407) 9030-0 |
| Fax: | +49 (2407) 9030-445 |
| E-mail: | invest@aixtron.com |
| Internet: | www.aixtron.com |
| ISIN: | DE000A0WMPJ6 |
| WKN: | A0WMPJ |
| Indices: | MDAX, TecDAX |
| Listed: | Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange; Nasdaq OTC |
| EQS News ID: | 1543771 |
| End of News | EQS Media |
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1543771 26.01.2023 CET/CEST
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