Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes
Highlights
Production-ready AI-driven EDA flows, powered by Synopsys.ai, on N2 deliver exceptional quality of results and accelerate design node migration for industry leadersDeveloping new backside power delivery capabilities on TSMC's A16 to enable efficient power distribution and system performanceJoint TSMC, Synopsys and Ansys multi-physics flow supporting CoWoS interposer packaging addresses thermal and power integrity challengesSynopsys 3DSO.ai delivers AI-driven system analysis for maximum quality of results with support for TSMC's 3DFabricNew development of 40G UCIe, HBM4 and 3DIO IP on advanced TSMC nodes optimizes latency, power, performance and areaThe information provided here is not subject to any editorial processing. It is prepared fully automatically and enriched with additional information and further research options. The aim of the content is to provide information seekers with the relevant information quickly and easily. A link back to the information provider and owner ensures that the data prepared here can be compared with the source information if required. The newsboard does not show information in real time. Please contact the exchange operator for this information if required. There is no claim to completeness. High availability cannot be guaranteed. If you notice any errors in the functionality, please let us know using the "Report a Bug" form below.
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