Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors
/ Key Highlights
Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers' reliability analysis needs for evolving 3D-IC designAnsys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC's compact universal photonics engine (COUPE) for optical data communicationThe information provided here is not subject to any editorial processing. It is prepared fully automatically and enriched with additional information and further research options. The aim of the content is to provide information seekers with the relevant information quickly and easily. A link back to the information provider and owner ensures that the data prepared here can be compared with the source information if required. The newsboard does not show information in real time. Please contact the exchange operator for this information if required. There is no claim to completeness. High availability cannot be guaranteed. If you notice any errors in the functionality, please let us know using the "Report a Bug" form below.
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