Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies
/ Key Highlights
Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (HPC) and artificial intelligence (AI)Ansys collaborated on a new AI-assisted radio frequency (RF) process migration flow that automates circuit designs and improves product performanceThe information provided here is not subject to any editorial processing. It is prepared fully automatically and enriched with additional information and further research options. The aim of the content is to provide information seekers with the relevant information quickly and easily. A link back to the information provider and owner ensures that the data prepared here can be compared with the source information if required. The newsboard does not show information in real time. Please contact the exchange operator for this information if required. There is no claim to completeness. High availability cannot be guaranteed. If you notice any errors in the functionality, please let us know using the "Report a Bug" form below.
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