Onto Innovation Inc.

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683344105
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www.ontoinnovation.com
LEI: 254900RXZVN73CHOO062
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Onto Innovation Inc.
GICS: - · Sektor: Technology · Sub-Sektor: Semiconductor Equipment & Materials
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Onto Innovation Inc.
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US6833441057
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5.523,04 S&P · 23,48 Vola-Index · 94.200,51 BTC · 1,13637 EURUSD
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Do., 10.04.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) will release its 2025 first quarter results shortly after the market closes on May 8, 2025. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the c...
Do., 06.02.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the fourth quarter and full year 2024. 2024 Fourth Quarter Financial Highlights Record revenue of $264 million led by advanced nodes and advanced packaging markets, delivering sixth consecutive quarter of growth. GAAP gross...
Do., 16.01.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 fourth quarter and full year results shortly after the market closes on February 6, 2025. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial offi...
Di., 14.01.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan™ system is introduced for detecting voids as small as ...
Di., 14.01.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) today announced that a leading DRAM manufacturer has finalized a $69 million volume purchase agreement spanning Onto Innovation’s optical metrology ecosystem, including common films, optical critical dimension, and integrated metrology. This agreement implies increased adoption of the Iris™ system for common films...
Mo., 06.01.2025       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that Michael Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will participate in the upcoming 27th Annual Needham Growth Conference, taking place at the Lotte New York Palace Hotel on January 15, 2025. Michael Plisinski w...
Do., 31.10.2024       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the third fiscal quarter of 2024. Third Quarter Financial Highlights Revenue of $252 million led by a recovery in advanced nodes and continued strength in advanced packaging supporting strong AI demand. GAAP gross margin 54% a...
Do., 31.10.2024       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO), a global provider of process control and packaging lithography solutions to the semiconductor market, today announced that it has acquired Lumina Instruments, Inc. based in Milpitas, California. “We are pleased to announce the 'tuck-in' of Lumina Instruments to strengthen Onto Innovation’s inspection portfolio t...
Mo., 14.10.2024       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 third quarter results shortly after the market closes on October 31, 2024. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host ...
Mi., 04.09.2024       Onto Innovation
US6833441057

Onto Innovation Inc. (NYSE: ONTO) today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages. Collaborating partners represent key process steps across the su...
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