News highlights:
The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.New integrated gallium nitride (GaN) power stages combine TI GaN and a high-performance gate driver with advanced protection features in an industry-standard transistor outline leadless (TOLL) package.DALLAS, March 17, 2025 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia.
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