Funded by the CHIPS Act, Microelectronics Commons will rely on Ansys digital engineering technology to support the evolution of domestically manufactured semiconductors

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Microelectronics Commons (Commons) network has eight regional technology hubs focused on spurring domestic innovation in 5G/6G, artificial intelligence (AI), electromagnetic (EM) spectrum dominance, Internet-of-Things (IoT) computing, and quantum and leap-ahead technologiesAnsys will provide services to six of the eight hubs through the Cross Hub Enablement Solution (CHES) program — MMEC, CA DREAMS, NEMC, NORDTECH, NW AI, SWAPAnsys Government Initiatives (AGI) — the United States national security division of Ansys — will work with industry, academic, and government organizations to produce mature prototypes to demonstrate the lab-to-fab concept, enabling a more robust workforce and enhancing the ME technology supply chain

Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations

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NVIDIA Modulus artificial intelligence (AI) framework will be integrated into the Ansys SeaScape™ cloud-optimized big data analytics platform for electronic design automation, which has demonstrated a speed-up of thermal simulation by over 100xThe Modulus physics-informed AI techniques strongly complement Ansys multiphysics simulation engines within SeaScape, including Ansys power integrity and reliability signoff platforms Ansys RedHawk-SC™, Ansys Totem-SC™, Ansys PathFinder-SC™, and Ansys RedHawk-SC Electrothermal™The integration will improve product outcomes for applications including graphics processing units (GPUs), high-performance computing (HPC) chips, AI chips, smartphone processors, and advanced analog integrated circuits

Ansys Fluent coupled with NVIDIA accelerated computing significantly speeds large-scale CFD simulations, reducing run time from four weeks to six hours

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Ansys Fluent® fluid simulation software solved a 2.4-billion-cell-problem using 320 NVIDIA GH200 Grace Hopper Superchips scaled with NVIDIA Quantum-2 InfiniBand at the Texas Advanced Computing Center (TACC)Combining NVIDIA Grace Hopper Superchips and Ansys software enables significantly faster, higher fidelity simulation, improving R&D processes for more innovative products

Ansys technology is instrumental in helping WEG develop an electric industrial motor that enables OEMs to push the limits of innovation through improved efficiency and productivity

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Ansys technology delivers an optimal balance of simulation speed and predictively accurate results to help WEG develop W80 AXgen, an electric industrial motor that can achieve efficiency levels beyond the current industry standardWEG used Ansys Mechanical™, Ansys Fluent™, Ansys Granta™, and Ansys Electronics™ to develop a performant, stackable, lightweight motor ideal for industrial applications including air compressors, water pump systems, and generators

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies

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Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (HPC) and artificial intelligence (AI)Ansys collaborated on a new AI-assisted radio frequency (RF) process migration flow that automates circuit designs and improves product performance

PITTSBURGH, Oct. 17, 2024 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that the Company expects to release its third quarter earnings on Wednesday, November 6, 2024, after the market closes. As previously announced, in light of the pending transaction with Synopsys, Inc. (Synopsys), Ansys has suspended quarterly earnings conference calls and no longer provides quarterly or annual guidance.

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals

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Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs)Ansys solutions will enable Faraday to optimize its interposer and multi-die designs, supporting better memory bandwidth, signal integrity, and performance of end applications

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors

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Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers' reliability analysis needs for evolving 3D-IC designAnsys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC's compact universal photonics engine (COUPE) for optical data communication

Ansys, TSMC, and Microsoft collaborate to speed-up simulation and analysis of silicon photonic components over 10X

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Ansys Lumerical™ FDTD 3D electromagnetic simulation software for photonic components demonstrates 10X faster simulation with Microsoft Azure Virtual Machines using NVIDIA graphics processing units (GPUs)With the scalability of Azure cloud, Ansys software delivers a comprehensive platform ideal for ushering in the next wave of silicon Photonic Integrated Circuit (PIC) technology for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence (AI)

NEW YORK, April 18, 2024 /PRNewswire/ -- Halper Sadeh LLC, an investor rights law firm, is investigating the following companies for potential violations of the federal securities laws and/or breaches of fiduciary duties to shareholders relating to:

Hess Corporation (NYSE: HES)'s sale to Chevron Corporation for 1.0250 shares of Chevron for each Hess share. If you are a Hess shareholder, click here to learn more about your rights and options.