Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies

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Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (HPC) and artificial intelligence (AI)Ansys collaborated on a new AI-assisted radio frequency (RF) process migration flow that automates circuit designs and improves product performance

PITTSBURGH, Oct. 17, 2024 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that the Company expects to release its third quarter earnings on Wednesday, November 6, 2024, after the market closes. As previously announced, in light of the pending transaction with Synopsys, Inc. (Synopsys), Ansys has suspended quarterly earnings conference calls and no longer provides quarterly or annual guidance.

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals

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Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs)Ansys solutions will enable Faraday to optimize its interposer and multi-die designs, supporting better memory bandwidth, signal integrity, and performance of end applications

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors

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Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers' reliability analysis needs for evolving 3D-IC designAnsys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC's compact universal photonics engine (COUPE) for optical data communication

Ansys, TSMC, and Microsoft collaborate to speed-up simulation and analysis of silicon photonic components over 10X

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Ansys Lumerical™ FDTD 3D electromagnetic simulation software for photonic components demonstrates 10X faster simulation with Microsoft Azure Virtual Machines using NVIDIA graphics processing units (GPUs)With the scalability of Azure cloud, Ansys software delivers a comprehensive platform ideal for ushering in the next wave of silicon Photonic Integrated Circuit (PIC) technology for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence (AI)

NEW YORK, April 18, 2024 /PRNewswire/ -- Halper Sadeh LLC, an investor rights law firm, is investigating the following companies for potential violations of the federal securities laws and/or breaches of fiduciary duties to shareholders relating to:

Hess Corporation (NYSE: HES)'s sale to Chevron Corporation for 1.0250 shares of Chevron for each Hess share. If you are a Hess shareholder, click here to learn more about your rights and options.