ACM Research, Inc.
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FREMONT, Calif., Dec. 11, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today issued comments regarding recent updates to U.S. export regulations.
Thermal and Plasma-Enhanced ALD furnace tools qualified for high-volume 300mm semiconductor manufacturing
FREMONT, Calif., Nov. 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM” or “ACM Research”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced management's participation in the 13th Annual NYC Summit 2024 investor conference (the “NYC Summit”), being held Tuesday, December 17, 2024, at Mastro’s Steakhouse New York.
FREMONT, Calif., Nov. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today reported financial results for its third quarter ended September 30, 2024.
Enhanced cleaning performance for advanced chip manufacturing; Significant chemical savings and environmental benefits
FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels
System delivers exceptional uniformity, enabling performance and cost efficiencies for next generation chip packaging
FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today reported financial results for its second quarter ended June 30, 2024.
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