SANTA CLARA, Calif., Feb. 4, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in infrastructure semiconductor solutions, today announced it will conduct a conference call following the release of its fourth fiscal quarter and fiscal year 2025 financial results on Wednesday, March 5, 2025, at 1:45 p.m. Pacific Time. 

Conference Call

Interested parties may join the conference call without operator assistance by registering and entering their phone number at https://emportal.ink/4h8OI7Q to receive an instant automated call back. To join the call with operator assistance, please dial 1-800-836-8184 or 1-646-357-8785. The call will be webcast and can be accessed at the Marvell Investor Relations website at http://investor.marvell.com/. A replay of the call can be accessed by dialing 1-888-660-6345 or 1-646-517-4150, passcode 19355# until Wednesday, March 12, 2025. 

Delivering Leading-edge Scale Up and Scale Out for AI Data Centers and Cloud Infrastructure

SANTA CLARA, Calif., Jan. 28, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will showcase its latest advancements in accelerated infrastructure silicon at DesignCon 2025. The event is scheduled for January 28-30, 2025, at the Santa Clara Convention Center in Santa Clara, California.

Visit Marvell at booth 1139 to see the latest accelerated infrastructure products and technologies, including:

SANTA CLARA, Calif., Jan. 16, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will host its Investor Day in New York City in the morning of Tuesday, June 10, 2025, with presentations from Chairman and CEO Matt Murphy and the senior leadership team. 

Event details and webcast access information will be provided in a press release closer to event date. In person attendance is by invitation only.  

About MarvellTo deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.

SANTA CLARA, Calif., Jan. 6, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology. Building on its recently announced custom high-bandwidth memory (HBM) compute architecture, Marvell is now extending its custom silicon leadership by enabling customers to seamlessly integrate CPO into their next-generation custom XPUs and scale-up the size of their AI servers from tens of XPUs within a rack currently using copper interconnects to hundreds across multiple racks using CPO, enhancing AI server performance. The innovative architecture enables cloud hyperscalers to develop custom XPUs that achieve higher bandwidth density and deliver longer reach XPU-to-XPU connections within a single AI server – with optimal latency and power efficiency. The architecture is now available for Marvell customers' next-generation custom XPU designs.

SANTA CLARA, Calif., Dec. 13, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), today announced a quarterly dividend of $0.06 per share of common stock payable on January 30, 2025 to shareholders of record as of January 10, 2025.

About Marvell

To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.

Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables  

SANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the general availability of a 200G per lane optimized transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable optics (LPO). Designed to address next-generation short-reach, scale-up compute fabric connectivity requirements, LPO modules enabled by the chipset overcome the reach limitations of passive, DAC cable interconnects. The LPO chipset expands the industry-leading interconnect portfolio from Marvell, which includes PAM4 optical DSPs, coherent DSPs, data center interconnects, Alaska® A active electrical cable (AEC) DSPs and Alaska P PCIe retimers, delivering an optimized optical solution for short-reach compute fabric connections, delivering an optimized optical solution for short-reach compute fabric connections.

New Aquila DSP Delivers Cost, Power, and Scalability for 2 km to 20 km Connectivity, Extending Marvell Optical Interconnect Leadership

SANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Aquila, the industry's first coherent-lite DSP optimized for 1.6 Tbps coherent optical transceiver modules operating at O-band wavelengths. By combining advanced coherent modulation with scalable O-band optics, the Aquila DSP delivers a power and performance-optimized solution tailored for the emerging market for distributed campus data center interconnects spanning up to 20 km with high bandwidth and low latency.

SANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

SANTA CLARA, Calif., Dec. 3, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today reported financial results for the third quarter of fiscal year 2025.

Net revenue for the third quarter of fiscal 2025 was $1.516 billion, $66.0 million above the mid-point of the Company's guidance provided on August 29, 2024. GAAP net loss for the third quarter of fiscal 2025 was $(676.3) million, or $(0.78) per diluted share. Non-GAAP net income for the third quarter of fiscal 2025 was $373.0 million, or $0.43 per diluted share. Cash flow from operations for the third quarter was $536.3 million.

New Ara PAM4 DSP Reduces Optical Module Power by 20%, Enabling Mass Adoption of 200 Gbps per Lane and 1.6 Tbps Network Infrastructure to Meet Rising AI Bandwidth Demands

SANTA CLARA, Calif., Dec. 3, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today introduced Marvell® Ara, the industry's first 3nm 1.6 Tbps PAM4 interconnects platform featuring 200 Gbps electrical and optical interfaces. Building on the success of the Nova 2 DSP, the industry's first 5nm 1.6 Tbps PAM4 DSP with 200 Gbps electrical and optical interfaces, Ara leverages the comprehensive Marvell 3nm platform with industry-leading 200 Gbps SerDes and integrated optical modulator drivers, to reduce 1.6 Tbps optical module power by over 20%. The energy efficiency improvement reduces operational costs and enables new AI server and networking architectures to address the need for higher bandwidth and performance for AI workloads, within the significant power constraints of the data center.